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SK Hynix breaks ground on a $4 billion AI chip packaging facility in Indiana.

Signals aggressive non-Korean scaling of advanced packaging capacity, tightening supply chain resilience for next-gen AI silicon.
NewswireSlicast · August 28, 2026 · US · Source: Google News
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SK Hynix breaks ground on a $4 billion AI chip packaging facility in Indiana.

Signals aggressive non-Korean scaling of advanced packaging capacity, tightening supply chain resilience for next-gen AI silicon.

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SK Hynix breaks ground on a $4 billion AI chip… · Slicast