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SK Hynix breaks ground on a $4 billion AI chip packaging facility in Indiana.

Signals aggressive non-Korean scaling of advanced packaging capacity, tightening supply chain resilience for next-gen AI silicon.
NewswireSlicast · August 27, 2026 at 14:02 UTC · US · Source: Reuters
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SK Hynix breaks ground on a $4 billion AI chip… · Slicast