SK Hynix is positioning Indiana as a primary United States manufacturing hub for high-bandwidth memory production by 2030.

As demand for artificial intelligence memory continues to strain global supply, SK Hynix is expanding its U.S. footprint with a $4 billion packaging facility in Indiana. The company says the site is meant to support domestic semiconductor supply chains and position the state as a major U.S. production base for high-bandwidth memory by 2030.

The Indiana project is focused on packaging rather than front-end manufacturing, meaning memory chips made in South Korea and China are to be stacked and connected at the U.S. site. Kwak says the first cleanroom for packaging is scheduled to open in October 2028.

The 133-acre campus, announced in 2024, is also set to include research and development centers where AI customers can work with SK Hynix on next-generation memory design. The company says this creates an opportunity to develop chips that are customized alongside the AI accelerators that use them.

To support the Indiana factory, SK Hynix is receiving up to $458 million in federal CHIPS Act funding and a state incentive package worth up to $712 million, according to the Indiana Economic Development Corporation. The company tells CNBC the facility is expected to create about 1,000 direct jobs, along with another 6,000 tied to construction and business partners.

Our earlier coverage of SK Hynix’s $4 billion Indiana facility explained how the project is designed to add U.S. high-bandwidth memory (HBM) packaging capacity and an AI semiconductor R&D center as AI data-center spending tightens global supply. We noted the timeline pointing to cleanroom operations starting in the second half of 2028, alongside expectations for thousands of local jobs and support via CHIPS Act incentives.