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TSMC plans 70% CAGR for N2/A16 advanced node capacity (2026–2028), with N2 first-year output 45% higher than N3. CoWoS/SoIC advanced packaging to grow >80% CAGR. Global HPC/AI demand to drive 55% of semiconductor market by 2030.
Critical validation of foundry capacity surge for advanced AI chip manufacturing; reinforces TSMC's supply-chain enablement for frontier compute.
Trade pressSlicast · June 26, 2026 · China · Source: 36氪
importance 88TSMC plans 70% CAGR for N2/A16 advanced node capacity (2026–2028), with N2 first-year output 45% higher than N3. CoWoS/SoIC advanced packaging to grow >80% CAGR. Global HPC/AI demand to drive 55% of semiconductor market by 2030.
Critical validation of foundry capacity surge for advanced AI chip manufacturing; reinforces TSMC's supply-chain enablement for frontier compute.