Chips & Hardware · Report

Jadeite plans a 7.8 billion yuan investment in an advanced semiconductor packaging factory in Shanghai Lingang.

Chinese OSAT capacity expansion critical for local chip assembly; two-phase buildout targets 2028 completion amid global packaging constraints.

Trade pressSlicast · June 24, 2026 · China · Source: 36氪

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Chinese OSAT capacity expansion critical for local chip assembly; two-phase buildout targets 2028 completion amid global packaging constraints.

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