Intel reveals details of its Xe-HPG DG2 discrete GPU lineup for gaming and data center applications.

Intel's Xe-HPG discrete graphics card lineup, based on the DG2 GPU, will span multiple core configurations ranging from entry-level to high-end, according to specifications leaked by Twitter users Harukaze, One Raichu, and Hougetsu. The rumored variants include a flagship 512 EU chip, followed by 384 EU, 256 EU, 192 EU, 128 EU, and 96 EU configurations, mirroring naming conventions used by competitors such as NVIDIA's Ampere lineup (GA102, GA104, GA106) and AMD's Navi GPUs (Navi 21, Navi 22, Navi 23).

The highest-end 512 EU variant will feature 4096 cores, a 256-bit bus interface, and up to 16 GB GDDR6 memory with an 8 GB GDDR6 option also listed. The 384 EU configuration will comprise at least three variants: the full-fat chip with 3072 cores, up to 12 GB GDDR6 memory, and a 192-bit bus, alongside cut-down versions with 256 EU (2048 cores, 8 GB or 4 GB GDDR6) and 192 EU (1536 cores, 4 GB GDDR6), both featuring 128-bit bus interfaces. Videocardz previously leaked the die configuration of the 384 EU variant, which measures 190mm², with a PCB blueprint showing six memory module locations confirming the 192-bit bus interface and 6 or 12 GB GDDR6 memory capacity. These mid-range variants are positioned as mainstream parts.

The entry-level 128 EU lineup will feature a full-fat SKU with 1024 cores, a 64-bit bus interface, and 4 GB GDDR6 memory, along with a cut-down variant offering 96 EUs or 768 cores with the same 4 GB GDDR6 memory across a 64-bit bus interface. This tier will be aimed at the entry-level desktop discrete market and will improve upon the DG1 GPU architecture with an improved design and better performance.

Built on the Gen 12 graphics architecture, the Xe-HPG GPUs will support ray tracing and other advanced capabilities, featuring new shading techniques. These discrete graphics cards are expected to arrive in both desktop and mobility designs, with development based on an external foundry process—most likely TSMC—and additional details anticipated by mid-2021.