Data center AI chip packaging technologies expected to see strong growth momentum through 2030.

Global data center AI chip shipments are projected to grow from 30.5 million units in 2024 to 53.4 million units in 2030, according to a report published by DIGITIMES Asia. This data center AI chip category includes high-end and mid-range GPUs, application-specific AI chips such as Google's TPUs, AI server CPUs, and networking and interconnect-related chips including Switch ASICs, rack-scale interconnect chips, DPUs, and NICs.

The fastest-growing segments by shipment volume are application-specific AI chips, mid-range GPUs that use GDDR DRAM such as Nvidia CPX GPUs, and interconnect-related chips such as NVSwitch ICs. In contrast, high-end GPUs and AI server CPUs show relatively lower growth over the 2024-2030 period, with a Compound Annual Growth Rate of only about 10%. However, revenue growth significantly outpaces shipment growth due to increased content value per chip and adoption of advanced packaging. AMD recently forecast that global server CPU revenue Total Addressable Market CAGR will reach 18% between 2025 and 2030, implying that the Average Selling Price CAGR for server CPUs could exceed 7%. For GPUs, despite moderate shipment growth, wafer foundry and packaging revenue CAGRs are both expected to exceed 40% in 2024-2030, driven by the increasing number of GPU and I/O dies per chip.

While application-specific AI chips like Google's TPU and AWS's Trainium have garnered significant attention for their tailored power-efficiency characteristics, the overall revenue share of data center AI chip packaging will remain GPU-centric throughout the 2024-2030 forecast period. By 2030, packaging revenue for data center GPUs is estimated to remain over 40% higher than that of application-specific AI chips. Although AI server CPUs and AI networking-related chips have high shipment volumes, the high-end packaging market will still be overwhelmingly dominated by GPUs and application-specific AI chips.

DIGITIMES Asia forecasts that the global market size for advanced packaging of data center AI chips will grow from US$5.6 billion in 2024 to US$53.1 billion in 2030, representing a CAGR of over 40%. This growth projection aligns closely with AMD's recent Financial Analyst Day estimate that the global Data Center TAM CAGR will exceed 40% over the next five years.