Digi Power X subsidiary filed a provisional patent for ARMS 200, a modular AI data center platform.

Digi Power X Inc (NASDAQ:DGXX, TSX-V:DGX) announced that its subsidiary US Data Centers has filed a provisional utility patent application for the ARMS 200 platform with the United States Patent and Trademark Office. The ARMS 200, or AI-Ready Modular Solution, is a Tier 3-certified modular data center platform designed to support high-density GPU clusters. CEO Michel Amar stated: "This provisional patent is the first step to protect the foundational architecture of our ARMS 200 platform."

The platform is being developed in collaboration with Super Micro Computer Inc (NASDAQ:SMCI) and is designed to support NVIDIA's Blackwell-class architecture. Each pod of the ARMS 200 platform delivers one megawatt of compute capacity and is configured for up to 256 NVIDIA B200 or B300 GPUs. The platform is designed for rapid deployment across enterprise, sovereign, and cloud-scale AI applications. It includes liquid cooling, dual-path power redundancy, and Digi Power X's NeoCloud orchestration system for GPU-as-a-Service operations.

Amar further noted: "Combined with our Supermicro partnership and Tier 3-certified design, we are positioning ourselves to scale the ARMS 200 from first deployments expected later this year into a full-fledged AI infrastructure network." At its flagship site in Alabama, Digi Power X intends to scale the ARMS 200 to 40 megawatts of critical power, totaling 55 megawatts, supporting approximately 10,240 NVIDIA GPUs. The initial deployment of the ARMS 200 platform is scheduled for the fourth quarter of 2025, following a previously announced purchase order with Supermicro for NVIDIA B200-powered systems.

The ARMS 200 patent application is the first in a planned series of modular systems from US Data Centers, which also includes the upcoming ARMS 300 and ARMS 400 platforms.