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Applied Materials (AMAT) and Broadcom (AVGO) announce joint packaging-technology partnership to advance AI supply chain.

Chipmaking-equipment and component leaders align on packaging roadmap; signals industry consolidation around advanced interconnect standards.
Trade pressSlicast · June 24, 2026 · US · Source: Google News
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Applied Materials (AMAT) and Broadcom (AVGO) announce joint packaging-technology partnership to advance AI supply chain.

Chipmaking-equipment and component leaders align on packaging roadmap; signals industry consolidation around advanced interconnect standards.

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CommentaryBroadcom Reports 143% AI Chip Revenue Growth, Cementing Custom Silicon Role — but Guidance Gap Tests Investor Patience
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Applied Materials (AMAT) and Broadcom (AVGO)… · Slicast