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Cloud startup secures $300 million in financing using AMD AI chips as collateral and deploys them in new Ohio datacenter.

Demonstrates AMD gaining US datacenter footprint and reveals alternative financing models for infrastructure buildout beyond traditional capital sources.
Trade pressSlicast · February 19, 2026 23:00 · Global · Source: tomshardware.com
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Image / Slicast · Source: tomshardware.com

Cloud startup secures $300 million in financing using AMD AI chips as collateral and deploys them in new Ohio datacenter.

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Cloud startup secures $300 million in financing using AMD AI chips as collateral and deploys them in new Ohio datacenter. · Slicast