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OpenAI disclosed technical specifications for its Jalapeño AI chip, revealing a 700W thermal design power (TDP) envelope designed for high-density liquid-cooled server racks.
Provides critical thermal and power planning parameters for data center engineers, confirming that next-generation custom inference silicon will require dense liquid cooling infrastructure rather than traditional air cooling.
Trade pressSlicast · August 25, 2026 at 14:24 UTC · US · Source: Data Center Dynamics
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