Lam Research, Applied Materials, and Camtek all rose following SanDisk's bullish financial guidance for 2030.
Semiconductor equipment makers have been climbing since Thursday's opening bell, driven by SanDisk (NASDAQ:SNDK), a NAND flash maker hosting its 2026 Investor Day today with a multi-year financial model signaling sustained memory capital spending. Lam Research (NASDAQ:LRCX) is up roughly 4% intraday, Applied Materials (NASDAQ:AMAT) up roughly 1.5%, and Camtek (NASDAQ:CAMT) is roughly flat after last week's sharp run, though it recovered from an opening decline of more than 1%.
SanDisk itself is up roughly 14% in the session as management outlined targets for fiscal 2028 through fiscal 2030. The company projects revenue growth in the mid-to-high teens, consistent with bit growth, along with non-GAAP gross margins of approximately 80%, non-GAAP operating margins around 75%, and adjusted free cash flow margin near 50%. Management also plans to return 100% of excess cash to shareholders after reinvestment.
The underpinning is contractual. SanDisk has signed New Business Model agreements with eight customers, representing approximately 50% of bits in FY2027 and roughly two-thirds in FY2028, backed by committed volumes and minimum financial guarantees. The company also flagged enterprise data center flash TAM growing to 1.2 zettabytes by 2030 and a new BiCS10 QLC node delivering a 60% bit density increase versus BiCS8. SanDisk posted Q4 FY2026 revenue of $8.965 billion, up 371.6% year over year, per its August 5 8-K.
A NAND maker guiding to mid-to-high teens revenue growth consistent with bit growth through the end of the decade, while committing to roughly 80% gross margins and 50% free cash flow margins, signals sustained wafer starts, new nodes, and advanced packaging investment. Bit growth requires tools. Equipment vendors sell those tools. A memory customer with contractually committed volumes tends to keep spending through a cycle.
Lam Research has the industry's largest NAND installed base and outsized exposure to etch and deposition, the process steps that matter most for 3D NAND layer scaling and HBM. CEO Tim Archer stated that "in NAND, demand is growing faster than previously expected… For every two to three million accelerators sold, we estimate an incremental one-point increase in overall NAND bit demand growth." Archer also expects advanced packaging business to grow more than 40% in 2026 and guided 2026 WFE to roughly $135 billion. Lam's most recent quarter delivered EPS of $1.82 versus $1.6836 expected on revenue of $6.72 billion. Its next report is scheduled for October 28, 2026.
Applied Materials' Q2 FY2026 delivered non-GAAP EPS of $2.86 versus $2.68 expected—a roughly 7% beat—on revenue of $7.91 billion, extending a five-quarter beat streak. Applied reports Q3 FY2026 results after the close today. CEO Gary Dickerson has been vocal about DRAM and HBM exposure, telling investors that "we expect to grow our packaging revenues more than 50% in calendar 2026" and that the semiconductor equipment business will grow more than 30% this calendar year.
Camtek delivered Q2 2026 non-GAAP EPS of $0.78 versus $0.7597 estimated on revenue of $133.243 million, a record. The non-GAAP figure excludes a $7.7 million one-time tax expense, $3.57 million of acquisition-related expenses, and $4.873 million of share-based compensation. Camtek's inspection and metrology franchise is levered to HBM and advanced packaging, segments benefiting from AI accelerator packaging demand. The stock is already up roughly 18% over the past week, which explains why it is not extending higher today.
Today's session moves are measured, but year-to-date figures show these names have already been re-rated on AI memory demand. SanDisk's targets are forward-looking projections for FY2028 through FY2030, and full GAAP reconciliations are not available. Memory capex is historically cyclical, equipment orders can be pulled quickly, and one customer's long-term model does not guarantee industry-wide capex.
Applied Materials reports after the close. That report and any commentary on DRAM, HBM, and NAND wafer starts will either validate or complicate today's read-through. Keep an eye on whether LRCX holds the intraday breakout into the close.