U.S. Department of Commerce announced $874 million in CHIPS Act funding across 7 semiconductor companies for R&D in integrated photonics, computing architecture, advanced packaging, substrates, materials, and storage.

U.S. Department of Commerce announced $874 million in CHIPS Act funding across 7 semiconductor companies for R&D in integrated photonics, computing architecture, advanced packaging, substrates, materials, and storage.

Broad government support targeting critical AI infrastructure supply-chain layers: interconnect, chiplet packaging, memory, and substrate technologies.