Friday, August 7, 2026
DarkSubscribe
AI Infrastructure · News & Analysis
HomeData CentersReport
Data Centers · Report

Wiwynn is showcasing next-generation cooling technology designed for high-density AI data centers where thermal management is the critical bottleneck.

Advanced cooling solutions enable higher GPU density per cabinet, reducing per-unit infrastructure cost and accelerating DC scaling without power supply constraints.
Trade pressSlicast · October 16, 2025 · Global · Source: electronicdesign.com
importance 65

At the OCP Global Summit 2025, Wiwynn unveiled a comprehensive lineup of next-generation AI infrastructure and cooling technologies developed in collaboration with Wistron. The showcase featured AI-optimized server systems designed to address the demanding requirements of modern data centers, including the NVIDIA GB300 NVL72, a liquid-cooled rack-level platform featuring 72 NVIDIA Blackwell Ultra GPUs and ConnectX-8 800Gb/s SuperNICs engineered for ultra-scale inference and reasoning workloads. Complementing this system, Wiwynn introduced the NVIDIA HGX B300, an eight-GPU, 10U system equipped with 2.1 TB of HBM3e memory and optimized for large-scale AI training. The company also presented its AMD Instinct MI350 series system, powered by EPYC CPUs and Pollara 400 AI NICs, which delivers a 35X increase in inference performance over previous generations.

Central to Wiwynn's infrastructure strategy is its Double-Wide Rack Architecture, designed to accommodate the latest high-power GPUs, including AMD's upcoming MI400 series. This innovative rack design doubles the traditional width and integrates HVDC power, advanced liquid cooling, and optimized signal layouts to address the growing data, power, and thermal requirements associated with large AI systems. The architecture represents a fundamental shift in how data centers can be configured to support increasingly demanding workloads.

On the cooling technology front, Wiwynn introduced three significant innovations. A double-sided cold plate is capable of handling up to 4 kW of heat dissipation, leveraging microchannel and 3D electrochemical printing technologies to achieve this performance. The company also demonstrated a two-phase cold plate utilizing eco-friendly dielectric refrigerants for efficient phase-change heat transfer. Additionally, Wiwynn unveiled a 300-kW AALC Sidecar, developed in partnership with Shinwa Controls, which brings liquid-cooled rack capability to air-cooled facilities without requiring infrastructure overhauls.

Completing the showcase, Wiwynn demonstrated its AI networking solutions featuring NVIDIA Spectrum-X Ethernet for AI networking, designed around Spectrum-4 MAC technology, alongside Broadcom's Tomahawk 6 datacenter switch. "At OCP Global Summit, we're proud to demonstrate our latest accelerated solutions and cooling innovations," said William Lin, President and CEO of Wiwynn. "Together with industry leaders, we're advancing the frontiers of AI computing performance and thermal efficiency. These collaborations enable a comprehensive suite of cutting-edge products that address the surging needs of both modern and legacy data centers in the AI era."

Read the original
Wiwynn is showcasing next-generation cooling… · Slicast