Sivers Semiconductors partners with O-Net Technologies to deliver next-generation external laser sources for co-packaged optics.

Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, announced on April 1, 2025, a strategic partnership with O-Net Technologies to produce high-performance external laser sources for next-generation AI data center architectures. The partnership, announced from KISTA, Sweden, positions O-Net Technologies as an OEM partner for Sivers Semiconductors.

Under the agreement, O-Net Technologies will integrate Sivers' advanced Distributed Feedback (DFB) laser arrays into their range of External Laser Small Form Factor (ELSFP) optical modules. This integration enables the adoption of Co-Packaged Optics (CPO) in switches, network interface cards, and artificial intelligence applications, delivering significantly reduced power consumption over traditional pluggable transceiver technology.

Vickram Vathulya, CEO of Sivers Semiconductors, stated: "This collaboration marks a significant milestone for the optical communication technologies market. By combining our expertise in high-performance laser solutions with O-Net's strong presence in optical networking, we can bring next-generation DFB lasers to a broader market. Together with O-Net Technologies, we are advancing the future of high-speed optical networking with cutting-edge photonic solutions."

Austin Na, Chairman of O-Net Technologies, emphasized the mutual benefits: "We are excited to partner with Sivers Semiconductors to enhance our ELSFP optical modules with their advanced DFB laser technology. This collaboration allows us to deliver higher performance and greater efficiency in optical interconnect applications, addressing the growing need for high-capacity, energy-efficient networking solutions for AI datacenter deployments."