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TSMC introduces advanced 6x reticle size Super Carrier Interposer for extreme system-in-package designs.
Enables more aggressive chiplet designs for future AI accelerators and processors with higher integration density.
Trade pressSlicast · May 26, 2023 · Global · Source: anandtech.com
importance 75TSMC introduces advanced 6x reticle size Super Carrier Interposer for extreme system-in-package designs.