Broadcom eyes up to a $100 billion AI financing deal to fund custom silicon and networking production ramps.

Broadcom Inc. (AVGO), a maker of chips and infrastructure software, is preparing a financing facility that could reach $100 billion. According to Reuters, citing Bloomberg, the company is negotiating with lenders to borrow more than $60 billion for an artificial intelligence chip funding package designed to support Anthropic and other startups.

The proposed structure would include approximately $30 billion in junior debt, alongside a senior secured tranche estimated at $60 billion to $70 billion. Broadcom is expected to provide partial backing for the senior debt. Blackstone Inc. (BX) and Apollo Global Management Inc. are also reportedly in discussions to participate.

This prospective financing builds on a $35 billion agreement announced in June between Broadcom, Blackstone, and Apollo to further expand Anthropic’s processing capacity using Broadcom’s proprietary chips and networking technology. While the initial phase targeted one gigawatt of capacity, the broader partnership aims to deliver more than 20 gigawatts for major AI laboratories by 2028.

The scale of these planned investments underscores the growing capital intensity of AI infrastructure. It also signals Broadcom’s expanded role beyond designing bespoke chips, as the company moves into helping clients finance the computing power required to deploy them.